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Introduction 1.Ultra-thin package, can be applied to miniaturized, thin circuit;
2.The metal cooling surface on the bottom of the package is large, heat dissipation performance is excellent;
3. It uses environmentally friendly materials, in line with RoHS standards;
4. Widely used in secondary rectifier circuit, converter, continuous current diode, AC/DC power supply protection;
Features 1.Excellent heat dissipation performance: the back Pad area is large, compared with the change of SOD-123FL/SMAF heat dissipation path, the original pin heat dissipation is changed to the back metal plate Pad heat dissipation, the metal heat dissipation area is increased by 150%, the instant heat dissipation performance is better, which makes it can withstand greater energy impact and have stronger lightning strike ability
2. Thin package shape: thinner than SOD-123FL package, 20% lower than SOD-123FL package thickness, 30% lower than SMAF body thickness, 20% shorter length, body thickness thinning to meet the development trend of thin packaging
SPECIFICATION

SM4FE SERIES SMFE SERIES

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